2018 Bond Issue Timeline

Bond Issue Timeline
2019-2023

A $155 million bond issue was approved by voters in November, 2018. The following charts provide a timeline for the improvements.
  • Projects are based on three important priorities: Safety and Security, Technology and infrastructure improvement as determined by the district's strategic, long-range facility program.
  • The timeline is based on a five-year construction program - 2019 through 2023.
  • The district's facilities improvement program designates the targeted areas of a building's infrastructure - such as portions of the roof, parking lot, etc. - that are in need of replacement.
  • The bond issue funds may only be used for the capital projects approved by voters. The funds may be not be used for day-today operating purposes, such as utilities or administrative, teacher or other staff salaries.

Elementary Timeline
Elementary Bond Issue Timeline, 2
Junior High School Bond Timeline

‚ÄčHigh School Timeline